Qualcomm may be many things, but it ain't stupid. On what basis do we make that bold claim? Historically, it's been very good about supporting and profiting from standards that aren't its own with one hand, even as it's pushing alternatives with the other. They've pulled this trick recently with comprehensive LTE support with CDMA migration -- a double whammy, considering that CDMA is Qualcomm's baby and LTE goes head to head with Qualcomm's UMB. Now, the firm is pairing up its MediaFLO mobile TV tech on a single hunk of silicon with support for ISDB-T, used in Japan and Brazil; essentially, the idea is that free programing would flow over ISDB-T and pay channels would come down on the FLO signal. It's an interesting concept, we suppose, but with mobile TV yet to be a profitable venture in most parts of the globe, it might be still be an idea just a bit ahead of its time.

[Via Phone Scoop]

If you're sick of hearing about end products and want to get down and dirty with the innards of handsets of tomorrow, look no further than Qualcomm. The firm is busting out a smorgasbord of new chips at Mobile World Congress today, so we'll get right to it. Up first is the QST1000, QST1100 and QST1105 chipsets, which include the following:

• An integrated ARM11 applications processor running at 528 MHz with support for third-party operating systems (Windows Mobile, Win CE and Linux)
  
• A comprehensive range of popular audio and video codecs
  Rich multimedia features, including camera, video playback at up to VGA resolution, and TV-out
  
• Seventh-generation gpsOne engine with support for Standalone-GPS and Assisted-GPS modes, as well as gpsOneXTRA Assistance technology delivering enhanced Standalone-GPS performance
  
• Support for Bluetooth, Wi-Fi and FM radio
  
• 65 nanometer process technology for enhanced battery life and bill-of-materials savings
• Ability to interface with Qualcomm's Universal Broadcast Modem (UBM) solution for MediaFLO, DVB-H and ISDB-T mobile broadcast TV support
• Wireless WAN connectivity for voice calls and data capabilities (QST1100)
• Hardware-accelerated 2D/3D graphics core capable of performing up to 2.8 million triangles per second (QST1105)
• All three are sampling now and are expected to begin launching this year

Head on past the break for more.

What if Toshiba were to produce a Blu-ray player? If there's one surefire sign that a company is recognizing the mortality of its own standards, it's throwing some support behind the competition's -- and that's exactly what Qualcomm has done in announcing new roadmaps for its mobile and cellular base station chipsets that include LTE. LTE, one of several 4G standards competing for the hearts and minds of carriers across the world, has a huge leg up on Qualcomm's own UMB and WiMAX (which is technically a pre-4G standard, anyway) by having the blessing of the GSM Association, the global juggernaut of mobile industry organizations. Anyway, Qualcomm's new plans call for future chipsets to support various flavors of UMTS, HSPA, and EV-DO, theoretically making it easier for carriers of all creeds to migrate to LTE while still supporting legacy cells and devices. The new silicon is expected to be available next year, and without a single major carrier having signed up for UMB, we'd say that's not a moment too soon.

Let's put aside Qualcomm's legal woes for just a moment and turn our attention to something a little more interesting and heartwarming: awesome-looking prototype devices. The company is showing off a pair of reference designs showcasing its new Snapdragon chipset, a heap of silicon said to offer one of the best power to performance ratios in the mobile world. First up, the "Fairbanks" is Qualcomm's idea of what a next-gen dedicated GPS unit might look like, rocking a 3 megapixel still / video camera, TV tuner, and microSD expansion on some sort of custom Windows CE base. Next up, the "Anchorage" (pictured) does the typical slide-out QWERTY smartphone concept in pure style with one critical difference -- this one is humming along at a staggering 1GHz. It's got pretty much every kind of radio one could want or need and apparently has enough horsepower to hoist a full OS, which only serves to further our deep, dark depression that they're not-for-retail concepts.

It's not like we weren't already aware of SiRF's participation in the Open Handset Alliance, but nevertheless, the company is sounding pretty ecstatic about the software developer kit it "just received." Reportedly, the outfit is already hard at work on "end-to-end location-enabling features" for Android, and in case you couldn't guess, it's also providing Android platform support for a plethora of products based on its famed SiRFstarIII architecture. Essentially, the firm is hoping to take advantage of having location as a "native feature" within Android, and it makes the obvious sound a whole lot more intriguing by teasing us with visions of "out-of-the-box locative experiences" involving geo-tagging, geo-searching and social networking. Still, we'll tip our hat to any form of tight integration, but this here's probably nothing to get riled up over.

Hot on the heels of its dual-3G Gobi chip comes a new trio of units from Qualcomm that cram a modem, multi-band RF transceiver, Bluetooth 2.1+EDR, FM radio and GPS capabilities into a 12- x 12-millimeter package. The units support UMTS, HSPA and EV-DO (depending on which you select), and there's also an ARM11 CPU that hums along at up to 600MHz for processing applications. Furthermore, each chip can handle a 5-megapixel camera, VGA display and TV output, and in case you hadn't guessed, they're all fabricated using 45-nanometer technology. No word on where exactly we'll see these used, but samples are scheduled to ship out in Q4 of next year.

[Via PhoneScoop]

In technology, speed is almost universally the enemy of power, and that rule certainly holds true in the world of cellular data standards. You heard it from His Steveness himself -- one of the main reasons we don't have a 3G iPhone on store shelves is because he isn't happy with battery life on HSDPA chipsets yet (consumers' opinions be damned, apparently), and in general, runtimes on 3G handsets large and small flag their 2G cousins, sometimes by a significant margin. Happily, the wiz kids at NTT DoCoMo are on the case, crafting Super 3G / LTE chipsets on 65nm dies capable of burning through 200Mbps at "sufficiently low power consumption" for mobile use. There's still no word on when NTT DoCoMo (or anyone else, for that matter) will be launching a commercial network at LTE speeds, but the company's hailing this latest batch of chips as a "milestone" on that journey -- and let's be honest, odds are good that Japan's gonna be rocking this stuff years before the rest of us anyhow.

[Via PhoneMag]

Apart from Verizon, it seems that carriers and manufacturers alike have kept a pretty steady stance on Qualcomm's far-from-over spat with Broadcom -- and in light of the most recent ruling allowing Qualcomm customers to ship products containing its chips, that stance may be paying off. HTC is the latest major manufacturer to reaffirm its relationship with the chip maker and patent holder extraordinaire, saying that it intends to release ten new models sporting Qualcomm innards by year's end. Big man Peter Chou himself chimed in on the issue, proclaiming "we are pleased to have a close strategic relationship with Qualcomm and look forward to bringing continued industry-changing devices to market." 'Course, you won't be bringing those industry-changing devices to the US if the court system ultimately rules against your bedfellow, Peter. Just thought you should know.

Qualcomm -- a company that's arguably more used to suing than being sued -- isn't finding much luck in its protracted quest to avoid a Broadcom-led ban of its 3G hardware from coming into the States. Following a recent denial of its motion to stay the ban in the court system, the President of The United States himself (or his administration, anyway) has swooped in to render an executive judgment, and it ain't looking any better for Qualcomm. Saying that the importance of protecting IP rights outweighs the inconvenience of the ban, the Bush folks have stood by the ITC's decision to impose the ban in the first place, making it seem all that much smarter now for Verizon to have sidestepped the whole ordeal and paid Broadcom itself. Barring any last minute antics, the ban gets enforced starting tomorrow.

Wireless handsets are becoming better gaming machines, although we're not seeing PSP-level playability yet on that slim-n-fast handset just yet. Toshiba, though, may want to change that -- and it's announced that a new 3D LSI chip that can render 100 mega-polygons per second to take mobile gaming and realism to the next level. As such, Toshy's new "TC35711XBG" chip is slated to be available to OEMs and ODMs in October. With 38 times the performance of existing solutions, built-in shading and reflectivity and WVGA support, we're chomping at the bit to see what this brings to the handset gaming table soon.

Sprint and Qualcomm have something else in mind, but we guess this is one way to get around the issue: Verizon has apparently lost patience with the ongoing tiff between Broadcom and Qualcomm that ultimately led to a ban on the import of some of the latter's 3G chipsets, opting instead to just pay Broadcom to license the affected patents itself. The agreement gives Verizon free reign to import all the 3G silicon it needs in exchange for $6 per handset, capping out at $40 million per quarter with a lifetime max of $200 million (oh, and Verizon promises to stop supporting Qualcomm's efforts to overturn the chip ban, too). Not a bad deal, we'd say, considering the totally critical nature of the chips to Verizon Wireless' core business -- kinda makes Verizon look like the parent and the two chip vendors like irrational, inconsolable toddlers, does it not?

[Via Phone Scoop]

It seems the feds agree with us that a broad, sweeping ban on little morsels of 3G goodness is just flat-out uncool. The US Court of Appeals for the Federal Circuit has turned the proverbial hourglass upside down, giving the US International Trade Commission two weeks to justify its partial halt on the import of devices equipped with 3G chipsets manufactured by Qualcomm. The spat originates over a Broadcom claim that Qualcomm's silicon infringes on its patents, and the court system is interested in hearing why the USITC thinks the ban should remain in place while Qualcomm appeals. Intellectual property issues aside, the ITC's cold-turkey ban stands to have a significant impact on carriers, handset manufacturers, and customers (that's us, by the way) as the selection suddenly dries up -- so at the very least, we're hoping everyone affected has a little more time to get their ducks in a row while the patent suit navigates the legal system (please?).

One of the most fragmented up and coming technologies in the mobile segment appears to be mobile TV. Europe's converging on DVB-H, Korea likes T- and S-DMB, Japan does one-seg, and the US seems to be moving toward MediaFLO. We can't necessarily expect a single device to support reception around the globe any time soon (if ever), but two in one is a good start -- and that'll soon be a reality thanks to a newly-developed chip from Sharp. The so-called VA3B5EZ915 (catchy name, if we do say so ourselves) supports both T-DMB and DVB-H while at the same time setting a new record for minimal power consumption. Theoretically, we guess this means travelers could get reception in both Europe and South Korea, though we're betting the more immediate application will be to unify Europe's few deployed T-DMB networks with the more popular DVB-H format without needing different lineups of phones for both. No word on when we might see the new chip in production handsets.

It seems the "set" part of "chipset" doesn't really apply to Qualcomm's latest solutions for WCDMA-based 3G handsets. Their QSC6240 and QSC6270 products -- for UMTS and UMTS / HSDPA, respectively -- integrate pretty much everything you need to make a phone on a single 65nm die (a radio transceiver, modem, processor, and power management subsystem, to be exact). Features include quad-band GSM, support for still cameras up to 3 megapixels, 72-tone polyphony, USB 2.0, 15fps video, and a veritable who's-who of codec support -- all in the manufacturer's choice of one 3G band from 800, 850, and 900MHz, and two from 1700, 1800, 1900, and 2100MHz. So if you were... you know, waiting for a single-chip solution to manufacture that UMTS phone you're planning, now's your chance.

[Thanks, TJ]

As multimedia features typically associated with higher-end handsets -- music players, video cameras, 3D acceleration, and the like -- start to trickle down to the mainstream, chip suppliers are looking at ways to make the requisite chipsets mainstream, too. Enter TI's OMAPV1035 "eCosto" single-chip platform; with an ARM9 processor core, the 1035 will be manufactured using a 65nm process when it begins volume production in early 2008. Features include EDGE support (but no 3G in sight -- we question that logic for a multimedia chipset that isn't due for another year), 30 fps video streaming at resolutions up to 320 x 240, 3D gaming, and support for still cameras up to 3 megapixels. Just as long as we get an HSDPA version of this goodness, TI, we're with you one hundred percent.