German chipmaker Infineon, supplier of silicon to a number of the world's phone manufacturers, has announced that CEO Wolfgang Ziebart will be packing up and shipping out as of June 1 due to a "difference in strategy" with the company. Specifics weren't given, but it's hard to ignore the fact that Infineon has posted five consecutive quarters of losses amidst a downturn in demand for its wares and poor performance at its Qimonda memory unit; what's more, rumor has it that an investment firm is looking to snatch up a giant share of Infineon and tie it up with Dutch semiconductor firm NXP, a plan Ziebart is said to have opposed. That may have fast-tracked his exit, but let's be honest, you can only go so many quarters in the red before your name starts to come up in "streamlining" meetings. Board member Peter Bauer will succeed Ziebart starting next month.

The folks at ZiPhone spotted some code in the brand new 2.0 beta iPhone firmware that could point to the chip to be used in the upcoming 3G iPhone. The code makes mention of "SGOLD3," which could very well refer to Infineon's followup chip to the S-GOLD2 which powers the current iPhone. Infineon's less fancy name for the S-GOLD3H chip is the PMB8878, a 7.2Mbps HSDPA chip with all the video acceleration and media playback features iPhone users have come to expect. Advantages over its predecessor include higher resolution camera support (5 megapixels instead of 2), a 2x speed MMC / SD interface and DVB-H module support, but that doesn't necessarily mean any of those specs will end up in the ensuing iPhone 3G -- S-GOLD2 has plenty of features the current iPhone doesn't take advantage of. The processor speed, however, remains the same.

[Via ZiPhone; thanks Adam B.]

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Hold the presses: Apple may be releasing a new iPhone this year... with 3G! Crazy, we know. The latest iteration of this rumor comes to us courtesy of UBS analysts, who say Infineon will likely be building chips for the phone -- they're powering the current iPhone, so no real surprise there. UBS is also betting on a mid-year 3G iPhone launch, and thinks that EDGE production will ramp down early so Apple gets a chance to clean out inventories. We've got a good feeling about this one, guys.

[Thanks, Tim G.]

After buddying up with IBM earlier this year on a 32-nanometer semiconductor, Infineon is now teaming with none other than Intel to produce high-density (HD) SIM cards. Announced today at the Cartes Trade Show in Paris, the agreement will spark a "strategic technology collaboration" which will see Infineon producing modular chip solutions while Intel offers up memory capacities from 4MB to 64MB. More specifically, a 32-bit security microcontroller will be provided by Infineon, while the partnership's other half throws in its "leading-edge flash memory technologies, capabilities and manufacturing." Apparently, the HD SIM will play nice with "data-intensive mobile applications, services and over-the-air downloads" which are likely to become more pervasive in the coming years, and current market research shows that these very devices will account for "six- to eight-percent of the total SIM card market in 2010." As for availability, look for samples to land in Q2 of next year, but don't expect 'em to be manufactured en masse until the first half of 2009.

[Via EETimes]